May 18, 2015 at 6:00 PM - Technology Interlocal Cooperative Agreement and Bond Messure Resolution Hearning
| Agenda |
|---|
|
1. Signature of Notification
|
|
2. Roll Call
|
|
3. Acknowledge Open Meetings Law
|
|
3.1. Notice of this Hearing was published in the Gering courier on May 7, 2015.
|
|
4. Public Hearning
|
|
4.1. Public comment regarding a proposed interlocal cooperative agreement and bond measure for technology purposes.
More Information:
Welcome to the Technology Interlocal Cooperative Agreement and Bond Measure Resolution hearing. The purpose of this hearing is to hear public comments on proposals by the district to enter into an interlocal cooperative agreement with other school districts and/or Educational Service Units and the plan to adopt a bond measure authorizing the interlocal cooperative to issue bonds regarding the financing of information technology up to a principle amount of $100,000. No action will be taken during the hearing. Any action will be taken during the regular board meeting.
Attachments:
()
|
|
5. Adjourn
|
